The Technology of Wafers and Waffles I: Operational Aspects

Karl F. Tiefenbacher

Anno: 2017
Rilegatura: Paperback / softback
Pagine: 712 p.
Testo in English
Dimensioni: 229 x 152 mm
Peso: 1470 gr.
  • EAN: 9780128094389
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Descrizione
The Technology of Wafers and Waffles: Operational Aspects is the definitive reference book on wafer and waffle technology and manufacture. It covers specific ingredient technology (including water quality, wheat flour, starches, dextrins, oils and fats) and delves extensively into the manufacturing elements and technological themes in wafer manufacturing, including no/low sugar wafers, hygroscopic wafers, fillings and enrobing. The book explains, in detail, operating procedures such as mixing, baking, filling, cooling, cutting and packaging for every type of wafer: flat and shaped wafers for making biscuits, ice cream cones, cups, wafer reels, wafer sticks (flute wafers) and biscuit wafers. It also explores the various types of European (Belgian) waffles and North American frozen waffles.