Hybrid Assemblies and Multichip Modules

di Kear (Autore)

Taylor & Francis Inc, 1992

Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.

• Autore: Kear
• Editore: Taylor & Francis Inc
• Collana: Manufacturing Engineering and Materials Processing
• Anno: 1992
• Rilegatura: Hardback
• Pagine: 296 p.
• Dimensioni: 234 x 156 mm
• Peso: 635 gr.
• EAN: 9780824784669

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