Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design

Sandip Bhattacharya (Curatore)

J Ajayan (Curatore)

Taylor & Francis Ltd, 2023

Aggressive scaling of device and interconnect dimensions has resulted in many low-dimensional issues in the nanometer regime. This book deals with various new-generation interconnect materials and interconnect modeling, and highlights the significance of novel nano-interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. Features: • Focuses on materials and nanomaterials utilization in next-generation interconnects based on carbon nanotubes (CNT) and graphene nanoribbons (GNR). • Helps readers realize interconnects, interconnect models, and crosstalk noise analysis. • Describes hybrid CNT- and GNR-based interconnects. • Presents the details of power supply voltage drop analysis in CNT and GNR interconnects. • Overviews pertinent RF performance and stability analysis. This book is aimed at graduate students and researchers in electrical and materials engineering, and nano-/microelectronics.

• Curatore: Sandip Bhattacharya, J Ajayan
• Editore: Taylor & Francis Ltd
• Anno: 2023
• Rilegatura: Hardback
• Pagine: 212 p.
• Dimensioni: 234 x 156 mm
• Peso: 489 gr.
• EAN: 9781032363813

Testo in English