System-in-Package: Electrical and Layout Perspectives

di Lei He (Autore)

Shauki Elassaad (Autore)

Yiyu Shi (Autore)

now publishers Inc, 2011

With the increasing scalability of semiconductor processes, the higher-level of functional integration at the die level, and the system integration of different technologies needed for consumer electronics, System-in-Package (SiP) is the new advanced system integration technology, which integrates (or vertically stacks) within a single package multiple components such as CPU, digital logic, analog/mixed-signal, memory, and passive and discrete components in a single system. This book focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of SiP. It first introduces package technologies, and then presents SiP design flow and design exploration. Finally, the paper discusses details of beyond-die signal and power integrity and physical implementation such as IO (input/output cell) placement and routing for redistribution layer, escape, and substrate. It is an invaluable reference for EDA researchers, professionals and graduate students.

• Autore: Lei He, Shauki Elassaad, Yiyu Shi
• Editore: now publishers Inc
• Collana: Foundations and Trends (R) in Electronic Design Automation
• Anno: 2011
• Rilegatura: Paperback / softback
• Pagine: 94 p.
• Dimensioni: 234 x 156 mm
• Peso: 146 gr.
• EAN: 9781601984586

Testo in English