Testing of Interposer-Based 2.5D Integrated Circuits

di Ran Wang (Autore)

Krishnendu Chakrabarty (Autore)

Springer International Publishing AG, 2017

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits.  The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.  This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.

• Autore: Ran Wang, Krishnendu Chakrabarty
• Editore: Springer International Publishing AG
• Anno: 2017
• Rilegatura: Hardback
• Pagine: 182 p.
• Dimensioni: 235 x 155 mm
• EAN: 9783319547138

Testo in English