Advances in Orchid Biology, Biotechnology and Omics

Pragya Tiwari (Curatore)

Jen-Tsung Chen (Curatore)

Springer Verlag, Singapore, 2023

This book provides comprehensive insights into the existing and emerging trends in orchid biology based on the findings of omics, high-throughput technology, biotechnology, molecular breeding, and genome editing approaches in orchids. It illustrates molecular mechanisms of orchid mycorrhizal symbiosis according to the recent achievements of transcriptomics and bioinformatics studies which accelerate the progress of orchid research with the aid of their high-throughput tools. In this book, a comprehensive view of orchid breeding was presented, and it includes fundamental methods as well as advanced strategies through the combination of several technologies such as genetic engineering, omics, computational biology, and genome editing. These resulting knowledge and tools are highly beneficial for obtaining novel and fascinating varieties in the orchid market which is a competitive industry of global trade. Another interesting content is the focus on the production of orchid bioactive compounds and their values in the field of ethnomedicine. Their sources chiefly came from secondary metabolites and can be enriched through elicitors and produced more efficiently by improved tissue culture protocols and bioreactors. In this edited collection, we provided space for presenting an updated review of in vitro seed germination which is a routine technology for well-trained researchers but can give a complete demonstration for the potential audiences including growers and research beginners. This book collects refined knowledge from a broad source of scientific literature by experts in the field of orchid research and surely is an adequate reference and textbook for students, teachers, and researchers. It includes methods and applications of orchid breeding technology which would gain high attention from growers, breeders, and the related fields of agriculture.

• Curatore: Pragya Tiwari, Jen-Tsung Chen
• Editore: Springer Verlag, Singapore
• Anno: 2023
• Rilegatura: Hardback
• Pagine: 283 p.
• Dimensioni: 235 x 155 mm
• EAN: 9789819910786

Testo in English