Carbon Nanotubes for Interconnects: Process, Design and Applications

Aida Todri-Sanial (Curatore)

Jean Dijon (Curatore)

Springer International Publishing AG, 2016

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

• Curatore: Aida Todri-Sanial, Jean Dijon
• Editore: Springer International Publishing AG
• Anno: 2016
• Rilegatura: Hardback
• Pagine: 333 p.
• Dimensioni: 235 x 155 mm
• EAN: 9783319297446

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