Interconnect Technologies for Integrated Circuits and Flexible Electronics

Yash Agrawal (Curatore)

Kavicharan Mummaneni (Curatore)

Springer Verlag, Singapore, 2023

This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.

• Curatore: Yash Agrawal, Kavicharan Mummaneni
• Editore: Springer Verlag, Singapore
• Collana: Springer Tracts in Electrical and Electronics Engineering
• Anno: 2023
• Rilegatura: Hardback
• Pagine: 280 p.
• Dimensioni: 235 x 155 mm
• EAN: 9789819944750

Testo in English