VLSI-SoC: From Systems to Silicon: IFIP TC10/ WG 10.5 Thirteenth International Conference on Very Large Scale Integration of System on Chip (VLSI-SoC2005), October 17-19, 2005, Perth, Australia

Ricardo Reis (Curatore)

Adam Osseiran (Curatore)

Springer-Verlag New York Inc., 2007

This book contains extended and revised versions of the best papers that were presented during the thirteenth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD conference. The 13th conference was held at the Parmelia Hilton Hotel, Perth, Western Australia (October 17-19, 2005). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier and Darmstadt. The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show industrial and academic research results in the field of mic- electronics design. The current trend toward increasing chip integ- tion and technology process advancements brings about stimulating new challenges both at the physical and system-design levels, as well in the test of these systems. VLSI-SOC conferences aim to address these exciting new issues. The 2005 edition of VLSI-SoC maintained the traditional structure, which has been successful at the previous VLSI-SOC conferences. The quality of submissions (107 papers from 26 countries) made the selection process difficult, but finally 63 papers and 25 posters were accepted for presentation in VLSI-SoC 2005. Out of the 63 full papers presented at the conference, 20 were chosen by a selection committee to have an extended and revised version included in this book. These selected papers came from Australia, Brazil, France, Germany, Italy, Korea, Portugal, Sweden, Switzerland, United Kingdom and the United States of America. x Preface

• Curatore: Ricardo Reis, Adam Osseiran
• Editore: Springer-Verlag New York Inc.
• Collana: IFIP Advances in Information and Communication Technology
• Anno: 2007
• Rilegatura: Hardback
• Pagine: 344 p.
• Dimensioni: 235 x 155 mm
• EAN: 9780387736600

Testo in English